Wafer Facilities

In the summer of 1998, Sarawak local officials resurrected efforts to build a semiconductor-processing plant in Kuching after the failure of a previous venture, called Interconnect Technology. With new investors, new management and renewed government support, 1st Silicon started up and struck a technology partnership with Sharp.

The facility is located on a 97 acres site in the Sama Jaya Free Industrial Zone of Kuching. In land resource terms alone, this is an ample area for three contemporary wafer fabs. The company estimates that it will reach a production capacity of 30,000 wafers per month at full capacity.

The entire complex will include manufacturing clean rooms, supporting technical laboratories and work rooms, customer design centers, conference rooms, staff training rooms, a cafeteria, general storage, chemical storage facilities, a central utility building and an electrical substation building. The initial fabrication facility will have 100,000 square feet of manufacturing space, and will eventually employ over 650 people.

Later on 1st Silicon disclosed the appointment of Meissner+Wurst Zander as the firm’s general contractor for the construction of its semiconductor wafer fabrication facility.

Meissner + Wurst Zander selected again Integral Vision for the project implementation of their over $320 million Wafer facilities project, phase 1, in Kuching, Sarawak, East Malaysia. Integral Vision was involved in the revision and preparation of all project procedures and the Work Breakdown Structure of the project. All PMIV modules were used. An interface with the client accounting system was developed.

A person from Integral Vision was seconded to M+W Zander for the full duration of the project. That person was able to support the project and during heavy work load to help various departments such as Project Control, the Procurement, the Engineering and the Document Control.

For more information please see Forwarding / Weiterleitung